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MDD-MD2301A
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MDD-SS14A

MDD-I2302

Features

  • Advanced trench process technology
    High Density Cell Design For Ultra Low On-Resistance

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SKU: SI2302MDD SOT23 Category:
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MDD-8550

Features

  • Complimentary to S8050
  • Collector Current: IC=0.5A
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MDD-ABS210

Features

  • Glass Passivated Chip Junction
  • Reverse Voltage - 100 to 1000 V
  • Forward Current- 2.0 A
  • Fast reverse recovery time
  • Designed for Surface Mount Application
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MDD-AO3400

Features

  • High dense cell design for extremely low RDS(ON)
  • Exceptional on-resistance and maximum DC current capability
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MDD-BAV21WS SOD-323

Features

  • Fast switching speed
  • Surface mount package ideally suited
  • for automatic insertion
  • For general purpose switching applications High
  • conductance
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MDD-BZT52C12-WH

Features

  • Total power dissipation: Max. 500mW.
  • Wide zener reverse voltage range 2.0V to 75V.
  • Small plastic package suitable for surface mounted design.
  • Tolerance approximately±5%
BRAND  RECTIFIER SKU
MDD BZT52C15-WJ 15V BZT52C MDD SOD123
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MDD-ES2JF

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
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MDD-MB10F

Features

  • Glass passivated die construction
  • Low forward voltage drop
  • High current capability
  • High surge current capability
  • Designed for surface mount application
  • Plastic material-UL flammability 94V-0
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MDD-MB10S

Features

  • Ideal for printed circuit board
  • Reliable low cost construction utilizing molded plastic technique
  • High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension
  • Small size, simple installation
  • High surge current capability
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