MDD-ABS210
Features
- Glass Passivated Chip Junction
- Reverse Voltage – 100 to 1000 V
- Forward Current- 2.0 A
- Fast reverse recovery time
- Designed for Surface Mount Application
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MDD-10M/SMC
Features
- The plastic package carries Underwriters Laboratory
- Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated placement
- High forward surge current capability
- High temperature soldering guaranteed:
- 250 °C/10 seconds at terminals
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MDD-B0520W
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
MDD-ES2J/SMB
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
MDD-ES5J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS: