Mechanical Data
Case : JEDEC SOD-323 molded plastic body
Terminals : Plated leads solderable per MIL-STD-750,
Method 2026
Polarity : Polarity symbols marked on case
Weight : 0.00019 ounce, 0.0548 grams
Marking:BAV19WS:A8, BAV20WS:T2, BAV21WS:T3
MDD-BBAV21WS
Features
- For surface mounted applications
- Glass Passivated Chip Junction
- Fast reverse recovery time
- Ideal for automated placement
- Lead free in comply with EU RoHS 2011/65/EU directives
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MDD-ES1J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- Placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES1JF
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 260°C/10 seconds at terminals Glass passivated chip junction