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MDD
MDD-AO3400
MDD-ABS210
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MDD-MD3401A
MDD-AO3400
Features
High dense cell design for extremely low RDS(ON)
Exceptional on-resistance and maximum DC current capability
DOWNLOADS:
Datasheet
SKU:
AO3400MDD SOT23
Category:
MDD
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Description
Shipping & Delivery
Description
APPLICATION
Load Switch for Portable Devices
DC/DC Converter
Shipping & Delivery
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Features
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 °C/10 seconds at terminals
DOWNLOADS:
Datasheet
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MDD-4148W
Features
Fast Switching Speed
Surface Mount Package
For General Purpose Switching Applications
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MDD-B107S
Features
Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic technique
High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
High surge current capability
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MDD-BAV21WS SOD-323
Features
Fast switching speed
Surface mount package ideally suited
for automatic insertion
For general purpose switching applications High
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MDD-BZT52C12-WH
Features
Total power dissipation: Max. 500mW.
Wide zener reverse voltage range 2.0V to 75V.
Small plastic package suitable for surface mounted design.
Tolerance approximately±5%
BRAND
 RECTIFIER
SKU
MDD
BZT52C15-WJ
15V BZT52C MDD SOD123
DOWNLOADS:
Datasheet
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MDD-ES2JF
Features
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated
placement High forward surge current capability
High temperature soldering guaranteed:
250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
Datasheet
Quick view
MDD-ES5J
Features
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated
placement High forward surge current capability
High temperature soldering guaranteed:
250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
Datasheet
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MDD-MB10F
Features
Glass passivated die construction
Low forward voltage drop
High current capability
High surge current capability
Designed for surface mount application
Plastic material-UL flammability 94V-0
DOWNLOADS:
Datasheet
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