Showing 17–32 of 48 results

MDD-ES2J

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES2J/SMB

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES2JF

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES3J/SMC

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES5J

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-I2302

Features

  • Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance
DOWNLOADS:

MDD-M4007PL-46

Features

  • Glass passivated device
  • Ideal for surface mouted applications
  • Low reverse leakage
  • Metallurgically bonded construction
  • High temperature soldering guaranteed:
  • 250°C/10 seconds,0.375”(9.5mm) lead length, 5lbs. (2.3kg) tension
DOWNLOADS:

MDD-M7 DO214AC

Features

  • The plastic package carries Underwriters Laboratory
  • Flammability Classification 94V-0
  • Idea for printed circuit board
  • Glass passivated Junction chip
  • Low reverse leakage
  • High forward surge current capability
  • High-temperature soldering guaranteed
  • 250 C/10 seconds at terminals
DOWNLOADS:

MDD-M7F

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • Idea for printed circuit board
  • Glass passivated junction
  • Low reverse leakage
  • High forward surge current capability
  • High temperature soldering guaranteed
  • 250℃/10 seconds at terminals
DOWNLOADS:

MDD-MB10F

Features

  • Glass passivated die construction
  • Low forward voltage drop
  • High current capability
  • High surge current capability
  • Designed for surface mount application
  • Plastic material-UL flammability 94V-0
DOWNLOADS:

MDD-MB10S

Features

  • Ideal for printed circuit board
  • Reliable low cost construction utilizing molded plastic technique
  • High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension
  • Small size, simple installation
  • High surge current capability
DOWNLOADS:

MDD-MD2301A

Features

  • Trench FET Power MOSFET
DOWNLOADS:

MDD-MD2301A

Features

  • Advanced trench process technology
  • High Density Cell Design For Ultra Low On-Resistance
DOWNLOADS:

MDD-MD3401A

Features

  • High dense cell design for extremely low RDS(ON)
  • Exceptional on-resistance and maximum DC current capability
DOWNLOADS:

MDD-MFG.PN:SS310

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Metal silicon junction,majority carrier conduction
  • Low power loss,high efficiency
  • Built-in strain relief,ideal for automated placement
  • High forward surge current capability
  • High temperature soldering guaranteed: 250 °C/10 seconds at terminals
DOWNLOADS:

MDD-S210

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Metal silicon junction,majority carrier conduction
  • Low power loss,high efficiency
  • Built-in strain relief,ideal for automated placement
  • High forward surge current capability
  • High temperature soldering guaranteed:
  • 250 °C/10 seconds at terminals
BRAND RECTIFIER SKU
MDD S24 SS24MDD SMA
DOWNLOADS: