Showing 1–24 of 48 results

MDD-10M/SMC

Features

  • The plastic package carries Underwriters Laboratory
  • Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated placement
  • High forward surge current capability
  • High temperature soldering guaranteed:
  • 250 °C/10 seconds at terminals
DOWNLOADS:

MDD-4148W

Features

  • Fast Switching Speed
  • Surface Mount Package
  • For General Purpose Switching Applications
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MDD-8050

Features

  • Complimentary to S8550
  • Collector Current: IC=0.5A
DOWNLOADS:

MDD-8550

Features

  • Complimentary to S8050
  • Collector Current: IC=0.5A
DOWNLOADS:

MDD-ABS210

Features

  • Glass Passivated Chip Junction
  • Reverse Voltage - 100 to 1000 V
  • Forward Current- 2.0 A
  • Fast reverse recovery time
  • Designed for Surface Mount Application
DOWNLOADS:

MDD-AO3400

Features

  • High dense cell design for extremely low RDS(ON)
  • Exceptional on-resistance and maximum DC current capability
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MDD-B0520W

Features

  • Low forward voltage drop
  • Guard ring construction for transient protection
  • High conductance
  • Also available in lead free version
BRAND SCHOTTKY DIODES SKU
MDD B0540W MBR0540MDD SOD123
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MDD-B107S

Features

  • Ideal for printed circuit board
  • Reliable low cost construction utilizing molded plastic technique
  • High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension
  • Small size, simple installation
  • High surge current capability
DOWNLOADS:

MDD-B207S

Features

  • Ideal for printed circuit board
  • Reliable low cost construction utilizing molded plastic technique
  • High temperature soldering guaranteed: 260°/10 seconds at 5 lbs., (2.3kg) tension
  • Small size, simple installation
  • High surge current capability
DOWNLOADS:

MDD-BAT54S

Features

  • Extremely Fast Switching Speed
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MDD-BAV21WS SOD-323

Features

  • Fast switching speed
  • Surface mount package ideally suited
  • for automatic insertion
  • For general purpose switching applications High
  • conductance
DOWNLOADS:

MDD-BBAV21WS

Features

  • For surface mounted applications
  • Glass Passivated Chip Junction
  • Fast reverse recovery time
  • Ideal for automated placement
  • Lead free in comply with EU RoHS 2011/65/EU directives
DOWNLOADS:

MDD-BZT52C12-WH

Features

  • Total power dissipation: Max. 500mW.
  • Wide zener reverse voltage range 2.0V to 75V.
  • Small plastic package suitable for surface mounted design.
  • Tolerance approximately±5%
BRAND  RECTIFIER SKU
MDD BZT52C15-WJ 15V BZT52C MDD SOD123
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MDD-BZT52C3V9-W5

Features

  • Total power dissipation: Max. 500mW.
  • Wide zener reverse voltage range 2.0V to 75V.
  • Small plastic package suitable for surface mounted design.
  • Tolerance approximately±5%
BRAND DIODE SKU
MDD BZT52C4V7-W7 4.7V BZT52C MDD
MDD BZT52C47-WV 47V BZT52C MDD
MDD BZT52C5V1-W8 5.1V BZT52C MDD SOD123
MDD BZT52C5V6-W9 5.6V BZT52C MDD SOD123
MDD BZT52C5V6S-W9 5.6V BZT52CS MDD SOD323
MDD BZT52C6V2-WA 6.2V BZT52C MDD
MDD BZT52C9V1-WE 9.1V BZT52C MDD
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MDD-ES1J

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • Placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES1JF

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 260°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES2J

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES2J/SMB

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES2JF

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES3J/SMC

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-ES5J

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:

MDD-I2302

Features

  • Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance
DOWNLOADS:

MDD-M4007PL-46

Features

  • Glass passivated device
  • Ideal for surface mouted applications
  • Low reverse leakage
  • Metallurgically bonded construction
  • High temperature soldering guaranteed:
  • 250°C/10 seconds,0.375”(9.5mm) lead length, 5lbs. (2.3kg) tension
DOWNLOADS:

MDD-M7 DO214AC

Features

  • The plastic package carries Underwriters Laboratory
  • Flammability Classification 94V-0
  • Idea for printed circuit board
  • Glass passivated Junction chip
  • Low reverse leakage
  • High forward surge current capability
  • High-temperature soldering guaranteed
  • 250 C/10 seconds at terminals
DOWNLOADS: