MDD-S34
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Metal silicon junction,majority carrier conduction
- Low power loss,high efficiency
- Built-in strain relief,ideal for automated placement
- High forward surge current capability
- High temperature soldering guaranteed: 250 °C/10 seconds at terminals
DOWNLOADS:
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MDD-ABS210
MDD-BBAV21WS
MDD-ES1J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- Placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
MDD-ES2J/SMB
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
MDD-ES5J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
DOWNLOADS:
