MDD-MD2301A
Features
- Advanced trench process technology
- High Density Cell Design For Ultra Low On-Resistance
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Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- Placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES1JF
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 260°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J/SMB
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2JF
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction