Mechanical Data
Case : JEDEC DO-214AB/SMC Molded plastic body
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position : Any
Weight : 0.0077ounce, 0.22grams
MDD-ES3J/SMC
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
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Related products
MDD-ABS210
MDD-BZT52C3V9-W5
Features
- Total power dissipation: Max. 500mW.
- Wide zener reverse voltage range 2.0V to 75V.
- Small plastic package suitable for surface mounted design.
- Tolerance approximately±5%
| BRAND | DIODE | SKU |
| MDD | BZT52C4V7-W7 | 4.7V BZT52C MDD |
| MDD | BZT52C47-WV | 47V BZT52C MDD |
| MDD | BZT52C5V1-W8 | 5.1V BZT52C MDD SOD123 |
| MDD | BZT52C5V6-W9 | 5.6V BZT52C MDD SOD123 |
| MDD | BZT52C5V6S-W9 | 5.6V BZT52CS MDD SOD323 |
| MDD | BZT52C6V2-WA | 6.2V BZT52C MDD |
| MDD | BZT52C9V1-WE | 9.1V BZT52C MDD |
MDD-ES1JF
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 260°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
