Mechanical DataÂ
Case : JEDEC ABS molded plastic body
Terminals : Solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body Mounting
Position: Any
Weight : 0.0031 ounce, 0.088 grams
MDD-ABS210
Features
- Glass Passivated Chip Junction
- Reverse Voltage – 100 to 1000 V
- Forward Current- 2.0 A
- Fast reverse recovery time
- Designed for Surface Mount Application
DOWNLOADS:
Description
Shipping & Delivery
Related products
MDD-BZT52C12-WH
MDD-ES1JF
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 260°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES5J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction