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MDD-S8050
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MDD-S8550

MDD-8550

Features

  • Complimentary to S8050
  • Collector Current: IC=0.5A

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SKU: C8550MDD SOT23 Category:
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MDD-8050

Features

  • Complimentary to S8550
  • Collector Current: IC=0.5A
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MDD-BAV21WS SOD-323

Features

  • Fast switching speed
  • Surface mount package ideally suited
  • for automatic insertion
  • For general purpose switching applications High
  • conductance
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MDD-BBAV21WS

Features

  • For surface mounted applications
  • Glass Passivated Chip Junction
  • Fast reverse recovery time
  • Ideal for automated placement
  • Lead free in comply with EU RoHS 2011/65/EU directives
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MDD-BZT52C12-WH

Features

  • Total power dissipation: Max. 500mW.
  • Wide zener reverse voltage range 2.0V to 75V.
  • Small plastic package suitable for surface mounted design.
  • Tolerance approximately±5%
BRAND  RECTIFIER SKU
MDD BZT52C15-WJ 15V BZT52C MDD SOD123
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MDD-ES2J/SMB

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
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MDD-ES3J/SMC

Features

  • The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
  • For surface mounted applications
  • Low reverse leakage
  • Built-in strain relief,ideal for automated
  • placement High forward surge current capability
  • High temperature soldering guaranteed:
  • 250°C/10 seconds at terminals Glass passivated chip junction
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MDD-M4007PL-46

Features

  • Glass passivated device
  • Ideal for surface mouted applications
  • Low reverse leakage
  • Metallurgically bonded construction
  • High temperature soldering guaranteed:
  • 250°C/10 seconds,0.375”(9.5mm) lead length, 5lbs. (2.3kg) tension
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MDD-M7 DO214AC

Features

  • The plastic package carries Underwriters Laboratory
  • Flammability Classification 94V-0
  • Idea for printed circuit board
  • Glass passivated Junction chip
  • Low reverse leakage
  • High forward surge current capability
  • High-temperature soldering guaranteed
  • 250 C/10 seconds at terminals
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