Mechanical Data
Case : JEDEC DO-214AB/SMC molded plastic body
Terminals : Solderable per MIL-STD-750,Method 2026
Polarity : Color band denotes cathode end Mounting
Position: Any
Weight : 0.0077 ounce, 0.22 grams
MDD-S36C
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Metal silicon junction,majority carrier conduction
- Low power loss,high efficiency
- Built-in strain relief,ideal for automated placement
- High forward surge current capability
- High temperature soldering guaranteed: 250 °C/10 seconds at terminals
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Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 260°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
MDD-ES2J/SMB
Features
- The plastic package carries Underwriters Laboratory Flammability Classification 94V-0
- For surface mounted applications
- Low reverse leakage
- Built-in strain relief,ideal for automated
- placement High forward surge current capability
- High temperature soldering guaranteed:
- 250°C/10 seconds at terminals Glass passivated chip junction
